| 发明名称 |
Integrated circuit protection and ruggedization coatings and methods |
| 摘要 |
An electronics package includes a substrate and at least one electronic component coupled to the substrate. The electronics package comprises an alkali silicate coating forming a hermetic seal around at least a portion of the at least one electronic component. |
| 申请公布号 |
US8076185(B1) |
申请公布日期 |
2011.12.13 |
| 申请号 |
US20060508782 |
申请日期 |
2006.08.23 |
| 申请人 |
ROCKWELL COLLINS, INC. |
发明人 |
LOWER NATHAN P.;WILCOXON ROSS K.;BOONE ALAN P. |
| 分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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