发明名称 Package for photoelectric wiring and lead frame
摘要 A package for a photoelectric wiring in which a pair of light emitting and receiving devices are mounted as optical devices on a lead frame having an optical waveguide in which an optical waveguide having a plurality of core portions disposed in parallel and surrounded by a cladding is mounted on a support plate of a lead frame having a mirror section including the support plate for supporting the optical waveguide, mirror sections having a mirror surface portion formed by bending both edges of the support plate at an angle of 45 degrees with respect to a planar direction of the support plate in a side direction, and lead portions to be electrically connected to the optical devices, the support plate, the mirror sections and the lead sections being formed by pressing a metallic material, wherein the light emitting device and the light receiving device are mounted in alignment with an optical path of a light reflected by the mirror surface portion and transmitted through the core portions at one of sides and the other side which interpose the optical waveguide of the package for an optical waveguide wiring therebetween.
申请公布号 US8076678(B2) 申请公布日期 2011.12.13
申请号 US20090545989 申请日期 2009.08.24
申请人 YAMAMOTO TAKANORI;SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 YAMAMOTO TAKANORI
分类号 H01L27/15;H01L29/16;H01L31/12;H01L33/00 主分类号 H01L27/15
代理机构 代理人
主权项
地址