发明名称 |
Electro-method and apparatus for improved chemical mechanical planarization pad with uniform polish performance |
摘要 |
A polishing pad includes a guide plate having a plurality of holes therein and being affixed to a compressible under-layer; and a plurality of conducting polishing elements each affixed to the compressible under-layer and passing through a sealed contact with a proton exchange membrane and corresponding hole in the guide plate so as to be maintained in a substantially vertical orientation with respect to the compressible under-layer but being translatable in a vertical direction with respect to the guide plate. The polishing pad may also include a slurry distribution material fastened to the guide plate by an adhesive. Pad wear sensors may also be provided in the polishing pad. |
申请公布号 |
US8075745(B2) |
申请公布日期 |
2011.12.13 |
申请号 |
US20050576942 |
申请日期 |
2005.10.05 |
申请人 |
BAJAJ RAJEEV;SEMIQUEST INC. |
发明人 |
BAJAJ RAJEEV |
分类号 |
C25F7/00 |
主分类号 |
C25F7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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