Method for the continuous laying of a conductor on a printed circuit board and device for carrying out said method

摘要

A method provides for welding a conductor to a conductive film which is suited for connection to a circuit board support in order to produce a printed circuit board. The depth or diameter of the conductor is preferably greater than the thickness of the conductive film. At least during the welding process, the conductive film is maintained in contact with a thermal isolation plate having a thermal conductivity less than that of the conductive film. After being placed on the circuit board support, the conductive film is partly etched away to electrically isolate electrical contact points.