| 摘要 |
PURPOSE: A method for forming a semiconductor element is provided to reduce the manufacturing time and cost of a microelectronic unit using sand blasting. CONSTITUTION: A semiconductor element(20), which includes a conductive pad(50), is provided. One or more first openings(30), which are extended from a backside surface(21) to a front side(22), is formed. A second opening(40), in which a part of the top surface and the bottom surface of the conductive pad, is formed. A conductivity contact(90) and a conductive interconnection part(80) are formed. The conductive interconnection part is connected to the conductive pad. |
