DEVICE AND PROCEDURE FOR CONTROL OVER TEMPERATURE OF SURFACE OF SUBSTRATE IN PROCESS CHAMBER

摘要

FIELD: machine building. ^ SUBSTANCE: substrate is placed in bearing recess (20) of support of substrate holders. The substrate holder is retained with dynamic gas cushion (8) formed with gas flow. Transfer of heat to substrate (9) is performed at least partially due to heat conductivity through gas cushion. Gas flow (8) forming gas cushion is formed of two or more gases with different high specific heat conductivity and composition of gases is changed depending on measured temperature of the substrate to reduce side deviations of substrate surface temperature from an average value. ^ EFFECT: efficient reduction of side deviation of temperature on substrate surface from average value and correspondingly increased quality of produced coating. ^ 16 cl, 5 dwg