发明名称 THREE DIMENSIONAL SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 <p>PURPOSE: A 3D semiconductor memory device and a manufacturing method thereof are provided to improve the working speed of a 3D nand flash memory device by forming a common source line using a metal material having resistivity. CONSTITUTION: A gate structure(170) is arranged on a substrate(100). The gate structure comprises a plurality of gate electrodes(171-178) which is laminated. Conductive lines are formed between the gate structure and the substrate. A horizontal semiconductor pattern is formed between the gate structure and the conductive line. The conductive line is directly connected to the bottom surface of the horizontal semiconductor pattern. The conductive line is parallel to the gate electrodes. A vertical semiconductor pattern is connected to the horizontal semiconductor pattern by passing through the gate structure.</p>
申请公布号 KR20110132865(A) 申请公布日期 2011.12.09
申请号 KR20100052439 申请日期 2010.06.03
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SON, YONG HOON;HWANG, KI HYUN
分类号 H01L21/8247;H01L27/115 主分类号 H01L21/8247
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