发明名称 PACKAGE FOR A LIGHT EMITTING DIODE AND METHOD FOR FABRICATING THE SAME
摘要 A method for fabricating a LED includes: providing a metal substrate; etching the metal substrate to form a first terminal, a second terminal, and a gap between the first terminal and the second terminal, wherein the first terminal has at least one first etching concave and the second terminal has at least one second etching concave; placing at least one LED chip in the at least one first etching concave, wherein the at least one LED chip has a first electrode and a second electrode; electrically connecting the first electrode with the first terminal, and electrically connecting the second electrode with the second terminal; and then covering the at least one LED chip with synthetic polymer, wherein the synthetic polymer is filled into the at least one first etching concave, the at least one second etching concave and the gap to connect the first terminal with the second terminal.
申请公布号 US2011300649(A1) 申请公布日期 2011.12.08
申请号 US201113214337 申请日期 2011.08.22
申请人 WANG BILY;CHUANG JONNIE;HUANG HUI-YEN;HARVATEK CORPORATION 发明人 WANG BILY;CHUANG JONNIE;HUANG HUI-YEN
分类号 H01L33/52;H01L33/48;H01L33/56;H01L33/62 主分类号 H01L33/52
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