发明名称 PRINTED CIRCUIT BOARD, ANTENNA, WIRELESS COMMUNICATION DEVICE AND MANUFACTURING METHODS THEREOF
摘要 <p>Disclosed are a low-loss printed circuit board, a low-loss broadband antenna, and methods for manufacturing the printed circuit board and the antenna using a resin as a substrate material. A resin material (101) having a predetermined shape is manufactured in a forming step, and the resin material (101) is foamed in a foaming step, thereby forming a skin layer (111) and a foam section (112). Since the skin layer (111) does not permit plating to be deposited thereon, the skin layer (111) is removed in a conductor pattern shape in a skin layer removing step, and the foam section (112) inside is exposed. Plating is deposited on the foam section (112), which has anchor effects, by performing electroless plating in a conductor layer forming step, and a conductor layer (120) is formed.</p>
申请公布号 WO2011152538(A1) 申请公布日期 2011.12.08
申请号 WO2011JP62850 申请日期 2011.06.03
申请人 FURUKAWA ELECTRIC CO.,LTD.;HAMADA, HIROKI;TAMAOKA, HIROYUKI;ISO, YOICHI 发明人 HAMADA, HIROKI;TAMAOKA, HIROYUKI;ISO, YOICHI
分类号 H05K3/18;H01P11/00;H01Q1/24;H01Q1/38;H01Q9/42;H01Q13/08;H04B1/18;H05K3/00;H05K3/14 主分类号 H05K3/18
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