| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermal conductive sheet which consists of a first electric-thermal conductive sheet and a second insulating thermal conductive sheet arranged on the periphery of the first electric-thermal conductive sheet, has an insulating periphery and an excellent thermal conductivity, and can surely prevent generation of short circuit and suppress displacement of the first incohesive-thermal conductive sheet from a space between a heat source and a heat dissipation member, and a semiconductor device using the thermal conductive sheet. <P>SOLUTION: A thermal conductive sheet is held between a heat source and a heat dissipation member of a semiconductor device, and consists of a first thermal conductive sheet and a second thermal conductive sheet arranged on the periphery of the first thermal conductive sheet. <P>COPYRIGHT: (C)2012,JPO&INPIT |
