发明名称 |
CIRCUIT BOARD WITH CONDUCTOR POST STRUCTURE |
摘要 |
Various circuit board interconnect conductor structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is disclosed that includes forming a conductor post on a side of a circuit board. The conductor post includes an end projecting away from the side of the circuit board. A solder mask is applied to the side of the circuit board to cover the conductor post. A thickness of the solder mask is reduced so that a portion of the conductor post projects beyond the solder mask. |
申请公布号 |
US2011299259(A1) |
申请公布日期 |
2011.12.08 |
申请号 |
US20100794535 |
申请日期 |
2010.06.04 |
申请人 |
HSIEH YU-LING;LEE I-TSENG;LIU YI-HSIU;TSAI JEN-YI;FAN CHENG-HUA |
发明人 |
HSIEH YU-LING;LEE I-TSENG;LIU YI-HSIU;TSAI JEN-YI;FAN CHENG-HUA |
分类号 |
H01R9/00;B23K1/20;H05K1/11 |
主分类号 |
H01R9/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|