WAFER DICING METHOD, CONNECTION METHOD, AND CONNECTING STRUCTURE

摘要

Provided is a wafer dicing method which improves the releasability of a protective film after the wafer has been processed. The wafer dicing method has: a pasting step (S1) in which a dicing tape (18) is pasted to the surface of a protective film (24) of a wafer (39) having an adhesive film attached thereto, said wafer (39) being formed by layering an adhesive layer (22) and a protective film (24) in said order on one surface (10a) of a wafer (10); an imaging step (S2) in which an image of the one surface (10a) of the wafer in the wafer (39) having an adhesive film attached thereto is taken from the surface (39b) on the other side of the wafer (39) having an adhesive film attached thereto; a division position determination step (S3) in which a position to divide the wafer (39) having an adhesive film attached thereto is determined on the basis of the image taken in the imaging step (S2); a cutting groove formation step (S4) in which a plurality of chips (60) having adhesive film attached thereto and provided with chips (64) having an adhesive layer attached thereto and a protective film (24) are formed on the basis of the position determined in the division position determination step (S3); and a pick-up step (S5) in which the chips (64) having an adhesive layer attached thereto are picked up from the chips (60) having adhesive film attached thereto.