发明名称 SENSOR MODULE AND SENSOR MODULE MANUFACTURING METHOD
摘要 Provided is a sensor module capable of ensuring security of data in which card data output from a magnet head is not stolen by a third party. In a sensor module 10A, a front-end portion of a flexible substrate 13 to which a connection terminal, a resistive element, an A/D conversion chip, and a digital IC are attached is accommodated in a housing 11 with a predetermined capacity in a state of being folded into four in one direction and the connection terminal, the resistive element, the A/D conversion chip, and the digital IC are fixed to the housing 11 together with the front-end portion of the flexible substrate 13 by means of epoxy resin filled in the housing 11.
申请公布号 US2011297745(A1) 申请公布日期 2011.12.08
申请号 US201013201692 申请日期 2010.02.19
申请人 ISUYAMA YASUO 发明人 ISUYAMA YASUO
分类号 G06K7/08;G01R3/00;H05K7/00 主分类号 G06K7/08
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