ENCLOSURE OF ELECTRONIC DEVICE

摘要

An enclosure includes a case and a heat dissipating area formed on the case. The heat dissipating area defines a number of heat dissipating holes in the heat dissipating area. The material of the heat dissipating area is thermo-responsive shape memory polymer. The heat dissipating holes have a first size in response to the temperature around the heat dissipating area being under a predetermined value. The heat dissipating holes can grow to a second size in response to the temperature around the heat dissipating area being greater than the predetermined value. The first size is less than the second size.