| 摘要 |
A film thickness measurement apparatus 1A includes a measurement light source 28 that supplies measurement light containing a measurement light component with a first wavelength λ1 and a measurement light component with a second wavelength λ2 to a measuring object 15, a spectroscopic optical system 30 that decomposes interfering light of reflected light from the upper surface and reflected light from the lower surface of the measuring object 15 into an interfering light component with the first wavelength λ1 and an interfering light component with the second wavelength λ2, photodetectors 31 and 32 that detect intensities of the first and second interfering light components at each time point, and a film thickness analysis section 40. The film thickness analysis section 40 obtains a temporal change in film thickness of the measuring object 15 based on a phase difference between a first phase in a temporal change in detected intensity of the first interfering light component and a second phase in a temporal change in detected intensity of the second interfering light component. Accordingly, a film thickness measurement apparatus and a film thickness measurement method by which a temporal change in film thickness of a film-shaped measuring object can be accurately measured are realized. |
