SEMICONDUCTOR MEMORY CHIP, SEMICONDUCTOR INTEGRATED CIRCUIT, SEMICONDUCTOR PACKAGE, SEMICONDUCTOR MEMORY DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE PACKAGE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a three-dimensional semiconductor device.

SOLUTION: A semiconductor memory chip comprises a data chip pad, a data input buffer coupled to the data chip pad, a latch coupled to the data input buffer and latching data output from the data input buffer, and a memory cell array. The data input buffer and the latch are a part of a first data writing path from the data chip pad to the memory cell array. The semiconductor memory chip further comprises a penetration electrode electrically coupled to an electric node of the first data writing path, and forming a second data writing path including a part of the first data writing path. The second data writing path is expanded from a chip terminal different from the data chip pad to the memory cell array.

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