| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance uniformity in the width at a space portion when a periodic pattern is exposed or formed. <P>SOLUTION: The patterning method of a wafer W includes a step for forming an L&S pattern 54A including multiple line patterns 40A on the surface of the wafer W, and a step for forming an L&S 56A including multiple linear resist patterns 42NA arranged between the multiple line patterns 40A on the surface of the wafer W so that the line widths of the line patterns 40A and the resist patterns 42NA have a negative correlation. <P>COPYRIGHT: (C)2012,JPO&INPIT |
