FLEXIBLE PRINTED CIRCUIT TO GLASS ASSEMBLY SYSTEM AND METHOD

摘要

Systems, methods, and devices relating to directly bonding electrode pads of a flexible printed circuit (FPC) to electrode pads of a glass substrate are provided. In one example, such a system may include a glass substrate with electrode pads and an FPC with corresponding electrode pads. A joining edge of each electrode pad of the FPC may couple directly to a joining edge of a corresponding electrode pad of the glass substrate, without an intervening conductive adhesive layer or an anisotropic conductive film (ACF) layer, or a combination thereof.