发明名称 |
TUNING OF POLISHING PROCESS IN MULTI-CARRIER HEAD PER PLATEN POLISHING STATION |
摘要 |
An apparatus and method for simulating a substrate being polished in a multiple carrier head per platen station when no substrate is provided in one or more of the multiple carrier heads is described. In one embodiment, a method for processing a substrate includes providing a single substrate to a polishing station adapted to process a plurality of substrates on a single polishing pad using at least a first carrier head and a second carrier head, retaining the single substrate in the first carrier head while the second carrier head remains substrate-free, urging the first carrier head and the second carrier head toward a polishing surface of the polishing pad; and providing relative movement between the polishing pad and the first carrier head. |
申请公布号 |
US2011300776(A1) |
申请公布日期 |
2011.12.08 |
申请号 |
US20100793389 |
申请日期 |
2010.06.03 |
申请人 |
MAI DAVID H.;JEW STEPHEN;HU XIAOYUAN (SANDRA);APPLIED MATERIALS, INC. |
发明人 |
MAI DAVID H.;JEW STEPHEN;HU XIAOYUAN (SANDRA) |
分类号 |
B24B1/00 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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