| 摘要 |
A substrate processing method including the steps of disposing a substrate having a recess in such a manner that the face having the recess is upward in the gravity direction, and applying a resist to the recess and face having the recess to form a resist film thereon, and disposing the substrate having the resist film formed thereon in such a manner that the face having the recess is downward in the gravity direction, and applying a liquid capable of dissolving the resist to the resist film to adjust the thickness of the resist film. A method for manufacturing a liquid ejection head is also provided. |
