发明名称 |
Chip-Type Electronic Component |
摘要 |
A chip-type electronic component with high reliability, which is able to suppress and prevent fatal damage to a ceramic body due to cracking even if a substrate with the chip-type electronic component mounted thereon undergoes a deflection. The chip-type electronic component includes a ceramic body having internal electrodes; resin electrode layers formed in a region including at least end surfaces of the ceramic body, and connected to the internal electrodes directly or indirectly and connected with the ceramic body; and plating metal layers covering the resin electrode layers, wherein the adhesion strength between the ceramic body and the resin electrode layer is higher than the adhesion strength between the resin electrode layer and the plating metal layer. |
申请公布号 |
US2011299221(A1) |
申请公布日期 |
2011.12.08 |
申请号 |
US201113150537 |
申请日期 |
2011.06.01 |
申请人 |
HIGASHI KATSUAKI;MATSUSHITA KOJI;SAKURADA KIYOYASU;MURATA MANUFACTURING CO., LTD. |
发明人 |
HIGASHI KATSUAKI;MATSUSHITA KOJI;SAKURADA KIYOYASU |
分类号 |
H01G4/008 |
主分类号 |
H01G4/008 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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