发明名称 |
MANUFACTURING METHOD OF PACKAGE, MANUFACTURING METHOD OF PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS AND RADIO-CONTROLLED WATCH |
摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a void from generation in a through electrode. <P>SOLUTION: A manufacturing method of a package capable of encapsulating an electronic component within a cavity formed between a plurality of substrates joined each other includes a through electrode formation process forming a through electrode which penetrates a first substrate 40 along a thickness direction among a plurality of substrates, inside of the cavity and outside of the package. The through electrode formation process comprises: a recess formation process forming recessed parts 30 and 31 in the first substrate 40; a conductive member arrangement process arranging a conductive member 9 in the recessed parts 30 and 31; a filling process filling the recessed parts 30 and 31 around the conductive member 9 with a filler 6a; and a desiccation process drying the filler 6a. A supersonic wave S is applied to the filler 6a during the filling process or between the filling process and the desiccation process. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2011250372(A) |
申请公布日期 |
2011.12.08 |
申请号 |
JP20100124352 |
申请日期 |
2010.05.31 |
申请人 |
SEIKO INSTRUMENTS INC |
发明人 |
FUNABIKI YOICHI |
分类号 |
H03H3/02;H01L23/02;H03H9/02 |
主分类号 |
H03H3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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