| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit device which includes a thin substrate mounting a circuit element with multiple connection pads as well as secures a rigidness of the entire device. <P>SOLUTION: The circuit device 10 mainly includes a substrate 12, a circuit element such as an element for signal processing 16 mounted on a top surface of the circuit substrate 12, and a case material 14 arranged on the top surface of the substrate 12 so as to enclose the circuit element. In addition, a part of an external connection bump 32 provided on an undersurface of the substrate 12 is arranged on a position overlapped with a side surface 14B of the case material 14. <P>COPYRIGHT: (C)2012,JPO&INPIT |
