METHOD FOR MANUFACTURING SUBSTRATE FOR SUSPENSION

摘要

PROBLEM TO BE SOLVED: To provide a substrate for a suspension with low rigidity that can be manufactured with high yield.

SOLUTION: A substrate for a suspension includes: at least a metal substrate; an insulating layer formed on the metal substrate; a seed layer formed on the insulating layer; and a wiring pattern layer formed of a metal plating layer formed into a pattern shape on the seed layer. A difference between a maximum film thickness portion and a minimum film thickness portion of the wiring pattern layer is 2 μm or less. In the substrate, an opening portion is formed in the insulating layer, and a cover layer is provided which is formed on the wiring pattern layer by using a cover material and has a wiring pattern layer exposed opening portion with an exposed part of the surface of the wiring pattern layer. A difference between a maximum film thickness portion and a minimum film thickness portion of the cover layer on the wiring pattern layer is 1 μm or less.

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