SEMICONDUCTOR DEVICE AND PROCESS FOR PRODUCTION THEREOF

摘要

Disclosed are: a semiconductor device equipped with a penetrated electrode (19); and a process for producing the semiconductor device. In the device and the process, an insulated-part-forming dummy slot (7b) which can insulate between wiring lines is arranged so as to surround a rewiring line layer (18) that involves the penetrated electrode (19) arranged on the back surface of a semiconductor substrate (5). For insulating between wiring lines, only a metal layer arranged on the bottom of the insulated-part-forming dummy slot (7b) has to be removed. Therefore, the treatment time can be reduced.