METHOD OF COUPLING HEAT DISSIPATION MODULE

摘要

PROBLEM TO BE SOLVED: To provide a method of coupling a heat dissipation module in which a heating member is coupled directly to a heat dissipating unit by a metal welding material in a through hole to improve overall efficiency of heat conduction, and efficiency in overall assembly can be enhanced.

SOLUTION: This method of coupling the heat dissipation module includes: a) a step S1 in which at least one through hole is formed in a circuit board in advance and the through hole is bored through two facing surfaces of the circuit board; b) a step S2 in which the circuit board is aligned on the heat dissipating unit and one surface of the circuit board is bonded to the coupling face of the circuit board; c) a step S3 in which the metal welding material is filled in the through hole; d) a step S4 in which at least one heating member is fixed to another surface of the circuit board and the heating member covers one end of the through hole at the same time so as to align it; and e) a step S5 in which the metal welding material in the through hole is melted by heating it, and the metal welding member is thereby welded to the heating member and the heat dissipating unit respectively.

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