| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solder bump forming device downsized, and accurately printing minute solder balls. <P>SOLUTION: The solder bump forming device comprises a film pasting mechanism 10 pasting a film 2 on a base plate surface, an exposure/developing mechanism 11 provided with openings on the film of an electrode 7 portion formed on a base plate 1, a filling mechanism 13 filling solder balls 4 in the openings, a flux printing mechanism 14 printing flux 5 through the openings 3 filled with the solder balls, a reflow portion 15 heating the solder balls to form solder bumps 6, and a film peeling mechanism 16 for peeling the film from the base plate surface. A controlling means of the solder ball filling mechanism actuates a line sensor after a filling heads fills the film openings with the solder balls to inspect the filling state of the solder balls, and determines whether the solder balls should be filled again or not according to the inspection result. <P>COPYRIGHT: (C)2012,JPO&INPIT |
