| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique which is advantageous for realizing a metal-based circuit board being excellent in heat dissipation property, insulation property, and peeling strength. <P>SOLUTION: A laminated plate for a circuit board 1 comprises: a metal board 2; a insulation layer 3 provided on the metal board 2 and containing liquid crystalline polyester and an inorganic filler of 50 vol.% or more, the inorganic filler being composed of at least one of aluminum nitride and aluminum oxide, and boron nitride, in a ratio of the boron nitride to the inorganic filler ranging from 35 vol.% to 80 vol.%; and a metal foil 4 provided on the isolation layer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
