| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress a conductive member to desorb from a first substrate and attain cost reduction. <P>SOLUTION: A manufacturing method of a package capable of encapsulating an electronic component within a cavity formed between a plurality of substrates joined each other includes a through electrode formation process forming a through electrode which penetrates a first substrate 40 along a thickness direction among a plurality of substrates, inside of the cavity and outside of the package. The through electrode formation process comprises: a recess formation process forming recessed parts 30 and 31 on a first surface 40a of the first substrate 40; a conductive member arrangement process inserting a conductive member 9 into the recessed parts 30 and 31 from the first surface 40a side so as to contact with the first substrate 40; a filling process filling the recessed parts 30 and 31 around the conductive member 9 with a filler; and a suction process in which the first substrate 40 is charged and the first substrate 40 absorbs the conductive member 9 by electrostatic force after the conductive member arrangement process and before the filling process. <P>COPYRIGHT: (C)2012,JPO&INPIT |
