| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can reduce thermal resistance without increasing chip area and cost, and to provide a method for manufacturing the same. <P>SOLUTION: A semiconductor device 100 comprises: a semiconductor substrate 1 having a semiconductor layer 1a and a wiring layer 1b; an active region 3 formed in the center of the semiconductor layer 1a from the surface thereof up to a predetermined depth; a connection electrode 4 formed in the active region 3 and on the wiring layer 1b on the periphery thereof and connected electrically with the semiconductor layer 1a; and a heat dissipation part which dissipates heat generated from the semiconductor layer 1a. The heat dissipation part has a heat dissipator 7 which fills at least one concave hole 5 formed from the rear face of the semiconductor layer 1a near to the active region 3. <P>COPYRIGHT: (C)2012,JPO&INPIT |
