| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a shield case which enables the temperature of a terminal portion for soldering to increase to a temperature suitable for soldering, thereby solving a problem that heat thermally diffuses from the terminal portion to a shield cover side and thus the terminal portion cannot be sufficiently heated, so that the temperature of the terminal portion does not increase to a temperature suitable for soldering when a shield case is soldered to a print circuit board. <P>SOLUTION: A loophole 4 for thermal diffusion suppressing means is formed in a terminal portion for joining a shield case 1 and a print circuit board 5 by soldering to suppress thermal diffusion from the terminal portion 3 to a shield cover portion 2. <P>COPYRIGHT: (C)2012,JPO&INPIT |
