| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing, having a sufficient adhesion property with a noble metal such as Ag and Au, having sufficient reflow-resistance and having sufficient flame-retardancy without reducing moldability and flowability; and to provide an electronic part apparatus including an element sealed by this. <P>SOLUTION: The epoxy resin composition for sealing includes: epoxy resin (A), curing agent (B) and indene-based oligomer (H) represented by a specific formula. The epoxy resin (A) contains epoxy resin (A1) represented by a specific formula and epoxy resin (A2) represented by a specific formula; and the content of the epoxy resin (A2) is 5-70 mass% of the total amount of the epoxy resin (A1) and the epoxy resin (A2). <P>COPYRIGHT: (C)2012,JPO&INPIT |
