发明名称 INJECTION MOLDING APPARATUS FOR THERMOSETTING RESIN
摘要 <P>PROBLEM TO BE SOLVED: To provide an injection molding apparatus, wherein curing of a thermosetting liquid molding material due to overheating of a nozzle is prevented while leakage of the thermosetting liquid molding material from a gap between the nozzle and a mold is prevented, for a thermosetting resin. <P>SOLUTION: A sealing member 44, which is brought into contact with a spool bush 22 when the thermosetting liquid molding material 8 is injected, is fitted to the end of a nozzle body 41. The sealing member 44, which has thermal insulation property and suppresses a temperature rise of the nozzle body 41, is disposed between the nozzle body 41 and the spool bush 22 and connected to material supply passages 22a and 41a to prevent the thermosetting liquid molding material 8 from leaking from a gap between the nozzle body and the spool bush. Furthermore, the nozzle body 41 is cooled and the thermosetting liquid molding material 8 is prevented from curing. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011245873(A) 申请公布日期 2011.12.08
申请号 JP20110179858 申请日期 2011.08.19
申请人 KOMATSULITE MFG CO LTD 发明人 MURAOKA YUJI;KITAGAWA TOSHIYA;YAMADA YOSHIYA;TAKAGAKI ATSUKO
分类号 B29C45/46;B29C45/62;B29C45/74 主分类号 B29C45/46
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