发明名称 BOARD LEVEL ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDS WITH THROUGH HOLE LATCHING MECHANISMS
摘要 Disclosed herein are exemplary embodiments of EMI shielding apparatus (e.g., one-piece shields, multi-piece shields, frames, etc.) having one or more latching members insertable into openings or holes in a substrate (e.g., printed circuit board, etc.) and engagable to the substrate. The engagement of the latching members with the substrate mechanically attaches the EMI shielding apparatus to the substrate.
申请公布号 US2011299262(A1) 申请公布日期 2011.12.08
申请号 US20100793246 申请日期 2010.06.03
申请人 CROTTY PAUL;LAIRD TECHNOLOGIES, INC. 发明人 CROTTY PAUL
分类号 H05K9/00;B23P11/00 主分类号 H05K9/00
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