发明名称 HEAT SINK MOUNTING FRAME APPLICABLE TO A VARIETY OF CIRCUIT BOARDS
摘要 An exemplary heat sink mounting frame is for mounting a heat sink onto a circuit board. The heat sink mounting frame includes a circular guide rail, and mounting arms movably connected with and extending radially and outwardly from the guide rail. Each mounting arm includes a fixing bracket connected to the guide rail and a sliding bar slidably connected with the fixing bracket. An engaging post is formed on the sliding bar. The sliding bar is slidable along the fixing bracket, such that a total length of each of the mounting arms is variable to adjust the locations of the engaging posts of the mounting arms.
申请公布号 US2011299249(A1) 申请公布日期 2011.12.08
申请号 US20100884221 申请日期 2010.09.17
申请人 CHAN HUNG-CHOU;YE ZHEN-XING;HON HAI PRECISION INDUSTRY CO., LTD.;HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD. 发明人 CHAN HUNG-CHOU;YE ZHEN-XING
分类号 H05K7/20 主分类号 H05K7/20
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