发明名称 |
PROCESSING SUBSTRATES USING A TEMPORARY CARRIER |
摘要 |
<p>A technique comprising: securing a device substrate (8) to a carrier (1) using one or more adhesive elements (6); forming electronic elements (10) on the device substrate with the device substrate thus secured to the carrier; and thereafter reducing the adhesion strength of at least one of the one or more adhesive elements to facilitate the release of the substrate from the carrier.</p> |
申请公布号 |
WO2011151457(A1) |
申请公布日期 |
2011.12.08 |
申请号 |
WO2011EP59220 |
申请日期 |
2011.06.03 |
申请人 |
PLASTIC LOGIC LIMITED;WATT, JAMES |
发明人 |
WATT, JAMES |
分类号 |
H01L21/683;H01L29/786 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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