发明名称 LASER PROCESSING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To form a deep scribe groove by maintaining high end face strength when forming a scribe groove by irradiating a laser beam on a brittle material substrate such as a glass substrate. <P>SOLUTION: The laser processing method is a laser processing method for forming a scribe groove by irradiating a laser beam along a scribe intended line of a brittle material substrate surface, and it includes a preliminary working process, and a scribe process. In the preliminary working process, the laser beam is irradiated along the scribe intended line of the brittle material substrate, and only melting is caused without causing ablation with respect to the scribe intended line. In the scribe process, the scribe groove is formed by irradiating a pulse laser beam along the scribe intended line. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011245774(A) 申请公布日期 2011.12.08
申请号 JP20100122199 申请日期 2010.05.28
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 FUKUHARA KENJI;OKAMOTO HIROKAZU;KOKUSHO TOMOJI
分类号 B28D5/00;B23K26/00;B23K26/32;C03B33/08;C03B33/09 主分类号 B28D5/00
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