| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multi-piece wiring substrate capable of individually confirming conduction state of an electronic component for each wiring substrate region. <P>SOLUTION: The multi-piece wiring substrate includes a mother board 1 in which a plurality of wiring substrate regions 1a are arranged vertically and horizontally at a central portion and a dummy region 1b is arranged on the outer periphery, with a plurality of insulating layers being stacked, a first wiring conductor 2 and a second wiring conductor 3 in which a part of each is exposed on the surface of the wiring substrate region 1a, a plurality of first plating wirings 4 for connecting a plurality of first wiring conductors 2 together in the wiring substrate region 1a arranged vertically, a plurality of second plating wirings 5 for connecting a plurality of second wiring conductors 5 together in the wiring substrate region 1a arranged horizontally, being arranged in an insulating layer different from the first plating wiring 4, and a common conductor which is provided to the dummy region 1b and is electrically connected to the first plating wiring 4 and the second plating wiring 5. The conduction state to an electronic component in each wiring substrate region can be individually confirmed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
