发明名称 |
METHODS OF FABRICATION OF PACKAGE ASSEMBLIES FOR OPTICALLY INTERACTIVE ELECTRONIC DEVICES AND PACKAGE ASSEMBLIES THEREFOR |
摘要 |
Packaging assemblies for optically interactive devices and methods of forming the packaging assemblies in an efficient manner that eliminates or reduces the occurrence of process contaminants. In a first embodiment, a transparent cover is attached to a wafer of semiconductor material containing a plurality of optically interactive devices. The wafer is singulated, and the optically interactive devices are mounted on an interposer and electrically connected with wire bonds. In a second embodiment, the optically interactive devices are electrically connected to the interposer with back side conductive elements. In a third embodiment, the optically interactive devices are mounted to the interposer prior to attaching a transparent cover. A layer of encapsulant material is formed over the interposer, and the interposer and encapsulant material are cut to provide individual packaging assemblies. In a fourth embodiment, the optically interactive devices are mounted in a preformed leadless chip carrier.
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申请公布号 |
US2011298077(A1) |
申请公布日期 |
2011.12.08 |
申请号 |
US201113212579 |
申请日期 |
2011.08.18 |
申请人 |
BOLKEN TODD O.;COBBLEY CHAD A.;ROUND ROCK RESEARCH, LLC |
发明人 |
BOLKEN TODD O.;COBBLEY CHAD A. |
分类号 |
H01L31/0203;H01L21/50;H01L21/82;H01L23/31;H01L31/18 |
主分类号 |
H01L31/0203 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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