发明名称 |
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT |
摘要 |
A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection. |
申请公布号 |
US2011299255(A1) |
申请公布日期 |
2011.12.08 |
申请号 |
US201113212467 |
申请日期 |
2011.08.18 |
申请人 |
NAKANISHI TERU;HAYASHI NOBUYUKI;MORITA MASARU;YONEDA YASUHIRO;FUJITSU LIMITED |
发明人 |
NAKANISHI TERU;HAYASHI NOBUYUKI;MORITA MASARU;YONEDA YASUHIRO |
分类号 |
H05K1/18;H01L21/60 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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