| 摘要 |
<p>Disclosed is a wafer transfer method which is provided with a step of giving buoyancy to the topmost wafer (Wf) of a plurality of wafers (Wf) stacked in a liquid, by jetting the liquid toward above the topmost wafer, and/or a step of reliably separating the topmost wafer by jetting the liquid toward the end surfaces of the wafers (Wf). Thus, the semiconductor wafer can be separated one by one without a manual operation, for instance, after cutting the semiconductor wafers by means of a wire saw.</p> |
