| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminate, for manufacturing a device, which can be positioned precisely and peeled smoothly after its manufacturing, and besides, is free from peeling in the process of its manufacturing, and a laminate circuit board thereof. <P>SOLUTION: This laminate is obtained by pasting one surface of one kind of inorganic layer selected from the group consisting of a sheet glass, a ceramic sheet, a silicon wafer and a metal, and one surface of a polyimide film which is obtained by a reaction between aromatic tetracarboxylic acids and aromatic diamines, with a linear expansion coefficient of -4 ppm/°C to +4 ppm/°C at 100 to 200°C (both in the longitudinal direction and the width direction of the film), with no intermediary of an adhesive layer. In addition, the surface of the polyimide film to which the surface of the inorganic layer is pasted, shows a surface roughness of not more than 15 nm in terms of P-V value. Also, the laminate circuit board is provided. <P>COPYRIGHT: (C)2012,JPO&INPIT |
