| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing that exhibits good adhesive properties to a noble metal such as Ag and Au and good reflow resistance and exhibits good flame retardancy without deteriorating moldability and flowability, and an electronic part device equipped with an element sealed with the same. <P>SOLUTION: The epoxy resin composition for sealing comprises (A) an epoxy resin, (B) a curing agent and (C) a phosphoric acid ester, where the epoxy resin (A) comprises (A1) an aralkyl novolak type epoxy resin represented by general formula (I) and (A2) a biphenyl type epoxy resin represented by general formula (II) with the content of the epoxy resin (A2) being 5-70 mass% based on the total amount of the epoxy resin (A1) and the epoxy resin (A2). Preferably, the epoxy resin composition contains the phosphoric acid ester (C) in an amount of 5-30 pts.mass based on 100 pts.mass of the epoxy resin (A). <P>COPYRIGHT: (C)2012,JPO&INPIT |
