发明名称 SOLID STATE IMAGE PICKUP DEVICE AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a solid state image pickup device and its manufacturing method capable of reducing optical color mixture. <P>SOLUTION: According to an embodiment, the solid state image pickup device is a backside illuminated type solid state image pickup device comprising a semiconductor substrate having a surface which has disposed thereon a plurality of photoelectric conversion sections including a first photoelectric conversion section and a second photoelectric conversion section adjacent to the first photoelectric conversion section and a reverse side opposite to the surface; a first color filter layer disposed on the reverse side of the first photoelectric conversion section so that a first color light will impinge upon the first photoelectric conversion section; and a second color filter layer disposed adjacent to the first color filter layer on the reverse side of the second photoelectric conversion section so that a second color light will impinge upon the second photoelectric conversion section. The first color filter layer includes a body section having a first thickness and an edge section disposed around the body section and having a second thickness thinner than the first thickness. The second color filter layer covers the edge section in a boundary region with the first color filter layer. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011249462(A) 申请公布日期 2011.12.08
申请号 JP20100119422 申请日期 2010.05.25
申请人 TOSHIBA CORP 发明人 UENO SOICHIRO
分类号 H01L27/14;H01L27/146;H04N5/369;H04N9/07 主分类号 H01L27/14
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