发明名称 |
METHOD FOR MANUFACTURING WIRING BOARD |
摘要 |
A method for manufacturing a wiring board includes forming a conductive pattern on an insulation layer, forming on the conductive pattern a resin insulation layer containing a resin and a silica-type filler, and irradiating a laser beam having an absorption rate with respect to the conductive pattern is in an approximate range of 30˜60% such that an opening portion reaching the conductive pattern is formed through the resin insulation layer. The silica-type filler in the resin insulation layer is in an amount of approximately 2˜60 wt. %.
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申请公布号 |
US2011300307(A1) |
申请公布日期 |
2011.12.08 |
申请号 |
US201113150744 |
申请日期 |
2011.06.01 |
申请人 |
NAKAI TORU;AMANO TETSUO;KAMANO ATSUSHI;TAKASAKI YOSHINORI;IBIDEN CO., LTD. |
发明人 |
NAKAI TORU;AMANO TETSUO;KAMANO ATSUSHI;TAKASAKI YOSHINORI |
分类号 |
B05D5/12;B05D3/06 |
主分类号 |
B05D5/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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