发明名称 RESIN COMPOSITION, HEAT-SEALABLE FILM, AND LAMINATED FILM
摘要 <p>A resin composition which comprises (1) at least one material that is selected from among ethylene·a,ß-unsaturated carboxylic acid copolymers and ionomers thereof and that has a melt flow rate of 0.5 to 6g/10min, (2) at least one material that is selected from among ethylene·a,ß-unsaturated carboxylic acid copolymers and ionomers thereof and that has a melt flow rate of 10 to 30g/10min, and (3) at least one material that is selected from among propylene homopolymer and copolymers of propylene and one or more other a-olefins, with the ethylene·a,ß-unsaturated carboxylic acid copolymers and the ionomers thereof being substantially free from structural units derived from a,ß-unsaturated carboxylic esters.</p>
申请公布号 WO2011152324(A1) 申请公布日期 2011.12.08
申请号 WO2011JP62274 申请日期 2011.05.27
申请人 DU PONT-MITSUI POLYCHEMICALS CO., LTD.;NAKANO, SHIGENORI;SUZUKI, KAORU 发明人 NAKANO, SHIGENORI;SUZUKI, KAORU
分类号 C08L23/08;C08L23/12;C08L23/14 主分类号 C08L23/08
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