发明名称 |
RESIN COMPOSITION, HEAT-SEALABLE FILM, AND LAMINATED FILM |
摘要 |
<p>A resin composition which comprises (1) at least one material that is selected from among ethylene·a,ß-unsaturated carboxylic acid copolymers and ionomers thereof and that has a melt flow rate of 0.5 to 6g/10min, (2) at least one material that is selected from among ethylene·a,ß-unsaturated carboxylic acid copolymers and ionomers thereof and that has a melt flow rate of 10 to 30g/10min, and (3) at least one material that is selected from among propylene homopolymer and copolymers of propylene and one or more other a-olefins, with the ethylene·a,ß-unsaturated carboxylic acid copolymers and the ionomers thereof being substantially free from structural units derived from a,ß-unsaturated carboxylic esters.</p> |
申请公布号 |
WO2011152324(A1) |
申请公布日期 |
2011.12.08 |
申请号 |
WO2011JP62274 |
申请日期 |
2011.05.27 |
申请人 |
DU PONT-MITSUI POLYCHEMICALS CO., LTD.;NAKANO, SHIGENORI;SUZUKI, KAORU |
发明人 |
NAKANO, SHIGENORI;SUZUKI, KAORU |
分类号 |
C08L23/08;C08L23/12;C08L23/14 |
主分类号 |
C08L23/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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