发明名称 METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide stable electrical characteristics to a semiconductor device using an oxide semiconductor to make the semiconductor device highly reliable. <P>SOLUTION: An island-shaped oxide semiconductor layer is formed using a resist mask, the resist mask is removed, oxygen is implanted (added) to the oxide semiconductor layer, and heat treatment is performed. Removal of the resist mask, implantation of oxygen, and heat treatment are consecutively performed without exposing to the air. Impurities such as hydrogen, moisture, hydroxyl, and hydride are intentionally removed from the oxide semiconductor layer by the oxygen implantation and the heating step. Before forming the oxide semiconductor layer, chlorine may be implanted to an insulating layer where the oxide semiconductor layer is formed. Hydrogen in the insulating layer is immobilized to prevent diffusion of hydrogen from the insulating layer to the oxide semiconductor layer by the chlorine implantation. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011249788(A) 申请公布日期 2011.12.08
申请号 JP20110099864 申请日期 2011.04.27
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YAMAZAKI SHUMPEI
分类号 H01L29/786;H01L21/336 主分类号 H01L29/786
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