SEMICONDUCTOR DEVICE TESTING EQUIPMENT, TESTING METHOD USING THE SAME, AND COAXIAL PROBE NEEDLE UNIT USED FOR THE SAME

摘要

PROBLEM TO BE SOLVED: To provide semiconductor device testing equipment capable of supporting even a thin wafer without flexural deformation thereof, and which eliminates the need for moving a probe needle in contact with a back surface electrode of the wafer even when a semiconductor element to be tested is shifted; a testing method using the same; and a coaxial probe needle unit used for the same.

SOLUTION: Semiconductor device testing equipment, a testing method using the same, and a coaxial probe needle unit used for the same are provided. The semiconductor device testing equipment comprises: a wafer chuck having a support surface for supporting a wafer to be tested; a movement mechanism for relatively moving the wafer chuck in both a vertical and horizontal direction with regard to an upper probe needle; a plurality of lower probe needles held in the wafer chuck and arranged in the support surface in a matrix configuration; tester equipment electrically connected to the upper probe needle while connected to each of the plurality of lower probe needles via a selecting switch; and a switching device for switching the selecting switch so that the lower probe needles corresponding to a semiconductor element at a testing position are electrically connected to the tester equipment.

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