MOISTURE-CURING REACTIVE HOT MELT ADHESIVE COMPOSITION

摘要

Provided is a curable composition that uses a polymer having reactive silicon groups of low toxicity, wherein the curable composition is useful as a reactive hot melt adhesive having an excellent balance between storage stability at high temperatures and curability at room temperature. The moisture-curing reactive hot melt adhesive composition either comprises(A1) an organic polymer containing reactive silicon groups having two hydrolysable groups and, as the curing catalyst, (B1) a carboxylic acid metal salt and/or carboxylic acid, or (A2) an organic polymer containing reactive silicon groups having three hydrolysable groups and, as the curing catalyst, (B2) a tetravalent tin compound.