发明名称 |
PRIMER COMPOSITION FOR HARDLY BONDABLE PLASTIC MATERIAL, BONDING METHOD, AND OPTICAL ENCODER |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a primer composition that forms a thin primer layer, wherein adhesiveness due to an adhesive agent between the hardly bondable plastic material and an adherend can be improved without degrading a surface of a hardly bondable plastic material. <P>SOLUTION: The primer composition for hardly bondable plastic material comprises: 0.1-20 mass% of inorganic particles each having an average grain size of ≥2 nm and ≤2 μm; 0.05-10 mass% of a peroxide; and ≥60 mass% of an aqueous vehicle. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2011246669(A) |
申请公布日期 |
2011.12.08 |
申请号 |
JP20100123790 |
申请日期 |
2010.05.31 |
申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
YOSHIDA YASUHIRO;YAMAMOTO YOSHINORI;SEKI HIROSHI;OGAWA MICHIO |
分类号 |
C09D5/00;C09J5/02;C09J201/00 |
主分类号 |
C09D5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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