发明名称 PRIMER COMPOSITION FOR HARDLY BONDABLE PLASTIC MATERIAL, BONDING METHOD, AND OPTICAL ENCODER
摘要 <P>PROBLEM TO BE SOLVED: To provide a primer composition that forms a thin primer layer, wherein adhesiveness due to an adhesive agent between the hardly bondable plastic material and an adherend can be improved without degrading a surface of a hardly bondable plastic material. <P>SOLUTION: The primer composition for hardly bondable plastic material comprises: 0.1-20 mass% of inorganic particles each having an average grain size of &ge;2 nm and &le;2 &mu;m; 0.05-10 mass% of a peroxide; and &ge;60 mass% of an aqueous vehicle. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011246669(A) 申请公布日期 2011.12.08
申请号 JP20100123790 申请日期 2010.05.31
申请人 MITSUBISHI ELECTRIC CORP 发明人 YOSHIDA YASUHIRO;YAMAMOTO YOSHINORI;SEKI HIROSHI;OGAWA MICHIO
分类号 C09D5/00;C09J5/02;C09J201/00 主分类号 C09D5/00
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